Seunghak Lee

Research Interests

  • DRAM Power Management for Low-power
  • High-integrity DRAM against Row hammering attack
  • Advanced Hybrid Memory System for High-performance and Low-power

Education

  • 2010~2017, Bachelor of Engineering, Computer Engineering, PKNU
  • 2017~2019, Master of Engineering, Dept. of Electrical Engineering and Computer Science, DGIST
  • 2019~2024, Ph.D. of Engineering, Dept. of Electrical Engineering and Computer Science, DGIST

Publications

* Corresponding Author
Nominated for the Best Paper Award
MICRO | TOP-Tier | Next-Gen Memory System

Hwanjun Lee, Minho Kim, Yeji Jung, Seonmu Oh, Ki-Dong Kang, Seunghak Lee, and Daehoon Kim*.

IEEE/ACM International Symposium on Microarchitecture (MICRO), 2025

Seunghak Lee, Jaeha Kung, and Daehoon Kim*.

Daegugyeongbuk Institute of Science and Technology (DGIST), 2024

CAL | SCI | Architecture Security

Seunghak Lee, Ki-Dong Kang, Gyeongseo Park, Nam Sung Kim, and Daehoon Kim*.

IEEE Computer Architecture Letters (CAL), 2023

CAL | SCI | Next-Gen Memory System

Hwanjun Lee, Seunghak Lee, Yeji Jung, and Daehoon Kim*.

IEEE Computer Architecture Letters (CAL), 2023

MICRO | TOP-Tier | Architecture Power/Resource Management

Seunghak Lee, Ki-Dong Kang, Hwanjun Lee, Hyungwon Park, Younghoon Son, Nam Sung Kim, and Daehoon Kim*.

IEEE/ACM International Symposium on Microarchitecture (MICRO), 2021

CAL | SCI | Next-Gen Memory System Power/Resource Management

Seunghak Lee, Nam Sung Kim, and Daehoon Kim*.

IEEE Computer Architecture Letters (CAL), 2019

Seunghak Lee, Sungjin Lee, and Daehoon Kim*.

Daegugyeongbuk Institute of Science and Technology (DGIST), 2019

Patents

Daehoon Kim, Hwanjun Lee, Minho Kim, and Seunghak Lee.

issued, Korea, Application No. 10-2020-0174852 (2020.12.14), Registration No. 10-2460848 (2022.10.26)

Daehoon Kim, Hyungwon Park, Seungkyu Lee, and Seunghak Lee.

issued, Korea, Application No. 10-2020-0174851 (2020.12.14), Registration No. 10-2479310 (2022.12.15)

Daehoon Kim, and Seunghak Lee.

issued, Korea, Application No. 10-2020-0058366 (2020.05.15), Registration No. 10-2495756 (2023.01.31)