Hwanjun Lee
Ph.D. Student

Research Interests

  • Computer Architecture & Systems
  • Memory Systems and Hybrid Memory Management for Emerging Memory
  • Disaggregated Memory Systems (e.g., CXL)
  • 2020~, Ph.D. candidate, Dept. of Electrical Engineering and Computer Science, DGIST
  • 2019~2020, M.S., Dept. of Electrical Engineering and Computer Science, DGIST
  • 2014~2019, B.S., School of Basic Science, DGIST

Publications

* Corresponding Author
MICRO | TOP-Tier | AI System

Minho Kim, Houxiang Ji, Hwanjun Lee, Jaeyoung Kang, Sungju Kim, Hyunkyun Shin, Daehoon Kim*, and Nam Sung Kim

IEEE/ACM International Symposium on Microarchitecture (MICRO), 2026

CAL | SCI | AI System Next-Gen Memory System

Yeji Jung, Hwanjun Lee, Sungju Kim, Seulki Kim, Yunhyeong Jeon, and Daehoon Kim*

IEEE Computer Architecture Letters (CAL), 2026

ISCA | TOP-Tier | Architecture AI System Next-Gen Memory System

Seulki Kim, Bokyeong Kim, Kyeonghyeon Ryu, Yeji Jung, Hwanjun Lee, Sungju Kim, Yunhyeong Jeon, and Daehoon Kim*

IEEE/ACM International Symposium on Computer Architecture (ISCA), 2026

CAL | SCI | AI System

Minho Kim, Houxiang Ji, Jaeyoung Kang, Hwanjun Lee, Daehoon Kim, and Nam Sung Kim

IEEE Computer Architecture Letters (CAL), 2025

Nominated for the Best Paper Award
MICRO | TOP-Tier | Next-Gen Memory System

Hwanjun Lee, Minho Kim, Yeji Jung, Seonmu Oh, Ki-Dong Kang, Seunghak Lee, and Daehoon Kim*

IEEE/ACM International Symposium on Microarchitecture (MICRO), 2025

CAL | SCI | Architecture Next-Gen Memory System

Yunhyeong Jeon, Minwoo Jang, Hwanjun Lee, Yeji Jung, Jin Jung, Jonggeon Lee, Jinin So, and Daehoon Kim*

IEEE Computer Architecture Letters (CAL), 2025

CAL | SCI | Next-Gen Memory System

Hwanjun Lee, Seunghak Lee, Yeji Jung, and Daehoon Kim*

IEEE Computer Architecture Letters (CAL), 2023

MICRO | TOP-Tier | Architecture Power/Resource Management

Seunghak Lee, Ki-Dong Kang, Hwanjun Lee, Hyungwon Park, Younghoon Son, Nam Sung Kim, and Daehoon Kim*

IEEE/ACM International Symposium on Microarchitecture (MICRO), 2021

Patents

Daehoon Kim, Hwanjun Lee, Minho Kim, and Seunghak Lee

issued, Korea, Application No. 10-2020-0174852 (2020.12.14), Registration No. 10-2460848 (2022.10.26)